Description

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The semiconductor manufacturing process mainly includes three main links: silicon wafer manufacturing, wafer (chip) manufacturing, and packaging and testing. Equipment used in the field of semiconductor manufacturing can usually be divided into silicon wafer manufacturing equipment, chip manufacturing front-end process equipment, and back-end packaging and testing. Three categories of equipment.

The processing and production of the semiconductor industry requires high-precision and high-speed work, and the requirements for power transmission and precision maintenance are very strict. The hollow rotary platform planetary reducer has the advantages of compact structure, high transmission accuracy, and stable torque output. It can control integrated The splicing of circuits or the rotation speed of silicon wafers on lithography machines can achieve high-precision manufacturing and measurement, so they are widely used in the semiconductor industry.

Advantages

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High control precision: The precision hollow rotating platform adopts a precision helical helical tooth structure, and the six-axis precision CNC integrated processing of aluminum profiles ensures the overall precision and error value.

Stable operation: precision machining hollow rotating platform, high bending rigidity, large diameter hollow structure, which is conducive to piping, saving production line equipment and carrying out indoor space design.

High temperature resistance: the hollow rotary platform can withstand high temperature, and control the rotation angle of silicon wafer or mask to realize high-precision process and measurement.

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